Conjunct Ltd: Lens Free Glass OSAs
Fibre-Lyte is a lens free optical sub-assembly on a glass substrate for deployment in demanding environments. This patented technology uses precise multi-layer tracks on borosilicate into which optical waveguides are processed. This configuration provides outstanding RF performance at 50G and a robust, stable optical performance over a wide temperature range.
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Waveguides
Fibre-Lyte uses in-wafer waveguides as a robust alternative to complex and expensive lens assemblies.
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No beam expansion.
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Reduced cross talk.
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Single and multimode support.
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No air gaps for particle contamination.
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No condensation ingress.
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No CTE mismatch.
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High-definition Tracks
Fibre-Lyte uses multi-layer wafer scale fabrication leading to finer tracks and layers than is possible in FR4.
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Thick and thin film processing.
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Improved definition.
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Better RF control.
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Tighter layer spacing than FR4.
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Improved ground plane control.
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Multiple materials on a single layer.
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Flip-Chip
Flip-chip assembly avoids the use of wire bonds, improving RF performance at 50G and making the assembly mechanically robust.
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Superior Thermal Management
Direct to die thermal path provides improved thermal management.
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The heat spreader is mounted directly to the opto-electronic devices.
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It efficiently spreads the heat from these devices on to an appropriate heat sink.
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Allows use of higher power components due to optimised thermal path.
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Electrical and Optical Interfacing
Electrical interfacing of Fibre-Lyte uses standard processes:
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Solder reflow compatible BGA interface.
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Add directly to a PCB or to a carrier interposer as shown below for electrical replaceability.
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Optical interfacing can be either horizontal or vertical:
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Simple two-dimensional alignment operation.
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Clear optical interface.
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MT compatible top surface.
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4+4 x25G Transceiver Specification
Fibre-Lyte packages a selection of off-the-shelf components and achieves high performance with them.
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850nm Tx and Rx
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0-85C typical (VCSEL limited)
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13.4dB link budget
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<1.5W power consumption.
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1E-12 capable.
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Extremely low crosstalk.
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Hi-Rel Environments
The OSA of choice for harsh environments or where reliability is key.
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Co-packaged optics.
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CTE well matched between optical substrate and die.
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No air-gap needed for lensing.
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